| Job Description | Job Description
Semiconductor Package engineering manager for developing the advanced package and package roadmap. Experiences: 10-15 years in semiconductor assembly or packaging engineering industry. Knowledge: Good knowledge on semiconductor package constructions, processes, properties and materials. Semiconductor packages include BGA (ball grid array), QFN (quad flat package with no lead), WLCSP (wafer level chip scale package) and FC (flip-chip) package etc. Processes include wafer backgrind, wafer saw, die attach, wire bond, mold and package saw singulation etc. Materials include die attach adhesives, bond wires and mold compound etc. Properties include thermal and electrical properties of packages.
Required Skills
Managing new package development for Cypress new product introduction in Cypress Philippines factory and major subcon partners. |
| | Company | | Cypress Semiconductor | Job Code | | State or Province | | California | | |
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