| Job Description | Requisition Number: AMS5553
Job Title: Packaging Engineering Manager
Category: Engineering
Business Unit: Advanced Mobile Solutions
Travel Required?: Yes
Shift: DY01 - Day Schedule
Job Description:
Be an integral part of a talented team designing the ever-changing complex products that is fueling the rapidly evolving wireless market. The Packaging Engineering Manager is responsible for leading a team of 10+ people prototyping the industry-leading state-of-the-art electronic devices for mobile communications. Other responsibilities include design and development of products and the transition to high-volume manufacturing at the largest module assembly site in North America and procurement and support of automated equipment and processes.
• Support the design, prototype assembly, documentation and release to production of new RFIC and multi-chip module (MCM) packages using appropriate technology.
• Develop and support assembly processes for engineering prototype parts. This includes specifying equipment, installing and supporting use of these tools.
• Acts as a liaison with internal Advanced Packaging Group, Suppliers, and Internal and External Manufacturing.
• Direct and manage Packaging resources used in design, development and documentation of industry leading wireless semiconductor products.
• Using appropriate tools, perform product cost trade-offs, package integrity analysis (thermal, mechanical, cross-sectioning, assembly process, etc.) for customer and internal requirements.
• Define package requirements for product groups assuring compliance with customer and internal Quality and Reliability requirements.
• Support the design and development of test fixture assemblies for product development and production test.
Job Requirements:
This individual must work well in a team environment on problems of a diverse scope where analysis of situations or data requires a review of identifiable factors. Must exercise judgment within defined procedures and practices to determine appropriate solutions. The ideal candidate will possess the following skills and experience:
- BS degree and 11 years of experience or an MS degree and 6 years of experience
- Knowledge of state-of-the-art materials and packaging related to semiconductor technology.
- Experience with manufacturing processes and equipment is desired
- Thermal and Mechanical Analysis, Auto-CAD and Cadence APD or similar CAD tools is preferred
- A basic understanding of Micro-Electronic Packaging and Manufacturing is also highly preferred |
| | Company | | Skyworks Solutions, Inc | Job Code | | State or Province | | California | | |
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