| Job Description | Position Summary (Gemini Campus)
This position is a member of an interdisciplinary team developing, improving, and maintaining processes and products to cement Cascade's role as a leading supplier of microelectronic test solutions. Uses knowledge of microelectronics processing, thin-film device physics, materials characterization, and process development to optimize product performance and solve process issues. The manufacturability and quality of products are a direct result of your work. Leads focused technical teams to solve complex issues.
This position is the unit-process owner of one or more unit process modules. The candidate works independently under the oversight of the Fab engineering manager and collaboratively with the engineering team.
Essential Functions
This engineer is responsible for sustaining and optimizing Fab processes, such as photolithography, wet etch and cleans, plasma etch and sputter deposition processes used in producing high frequency wafer probing and calibration structures. This engineer uses their broad knowledge of thin-film device physics and processing to troubleshoot process issues. Organizes and maintains data and transforms data into information effectively. Communicates results clearly with stakeholders though written reports and verbal presentations.
Collaborates with interdisciplinary teams to solve complex manufacturing or development issues. Uses structured problem solving and team building skills to create and maintain high performance teams. Uses project management techniques to achieve objectives quickly and efficiently.
Establishes, sustains and optimizes manufacturing processes for high yield and short cycle time through the use of statistical process control tools. Responsible for continuous improvement in manufacturing process yield and throughput. Documents processes clearly and concisely and trains technicians to work instructions. Takes a lead role in capital equipment planning, budgeting, order placement, installation, process development, and qualification.
Minimum Qualifications
Bachelor's degree in Applied Physics, Physics, Electrical Engineering, Materials Science or similar field and a minimum of 8 years of process engineering experience in a semiconductor, microelectronics, or similar setting is required.
Technical Skills and Knowledge
Candidates should have a background in applied physics, materials science, or chemical engineering and practical experience working with a variety of semiconductor/photovoltaic/and thin-film process techniques. Familiarity with semiconductor manufacturing techniques including spin coating, electroplating, wet/dry etching, and/or precision assembly techniques is required. Proficiency in theory and practical application of several manufacturing techniques such as Lithography, Plasma Etch (Dry Etch) and/or Sputter Deposition processes and equipment is strongly desired.
The position requires candidates to have a working knowledge of applied statistics including Design of Experiments, metrology and gauge capability analysis, and statistical process control. Proficiency performing statistical analysis with a software tool such as JMP or MiniTab is strongly desired. Candidates must be proficient with MS Office tools including Word, Excel, Outlook, PowerPoint.
Performance Skills
The ideal candidate will be a self-starter who has the ability to analyze a process, determine gaps/inefficiencies/yield improvement opportunities, develop a road map to achieve this vision, and drive the project to completion.
Successful candidates will be confident and flexible team-players looking to leverage their skills on a high performance team and will be eager to find opportunities to improve. Excellent organizational skills and a high attention to detail are highly desired. A demonstrated track record of managing New Product Introduction projects to successful completion is a desired.
Candidates must have a demonstrated ability to communicate complex ideas effectively in writing and verbally.
Physical Requirements
Candidates must be able to understand and follow safety procedures. The position requires the candidates to work at a computer, microscope, or laboratory instrument for extended periods of time. Occasional lifting of up to 50 pounds is required, with occasional bending, stooping. On-call support of manufacturing during off-shifts is required. Occasional (5% or less) travel may be required. Reasonable accommodations will be made to enable individuals with disabilities to perform the essential functions. Candidates must be able to successfully complete a pre-employment drug screen. |
| | Company | | Cascade Microtech | Job Code | | State or Province | | Oregon | | |
|
