|Job Description Engineering ownership for sustaining, improving, and developing process and equipment capability for MEMS Wafer and Ceramic Dicing. Apply Statistical Process Control (SPC) and continuous improvement methodologies to ensure manufacturing processes remain both predictable and capable at the lowest possible operating cost. Engage and lead equipment vendors to improve tool performance and ensure established manufacturing targets for equipment utilization and uptime are met or exceeded. Engage and lead material vendors to ensure proper procurement specifications and incoming quality assurance metrics are established and consistently met for key process direct and indirect materials. Work closely with peers in Research and Develop to either utilize existing processes and/or equipment or develop new processes and/or equipment to meet requirements driven by new products and technology roadmap. Own training and transfer of new processes and/or equipment from engineering to operations personnel.
Skill Requirements Bachelorís degree or foreign equivalent in Electrical Engineering, Mechanical Engineering, Materials Science Engineering, Electronics Engineering, or related.
7 years of progressive experience as Product Engineer, Process Engineer or related occupations
Must have experience with indirect materials required for operating a precision substrate dicing and component singulation process in a custom, high-volume manufacturing environment. Work experience with the development of new process technology and capabilities and successful transfer from pilot to high-volume capability. Experience in use of Statistical Process Control and Design of Experiments; quality and continuous improvement methodologies such as Failure Mode and Effects Analysis (FMEA), Root-cause Analysis (RCA), and/or Lean Manufacturing.
Category Engineering Job Type Regular Full-Time Requisition # 3805 Education Bachelor's Degree or Equivalent Career Level Experienced (Non-Manager)
State or Province